详细描述
SOI Wafers
| Specifications | SOI Wafers |
| Diameter | 3" (76.2 mm) 100 mm 125 mm 150 mm 200 mm |
| Device Layer | 380 nm - 100 µm |
| BOX Layer | 100 nm - 10 µm |
| Handle Layer | 300 µm - 775 µm |
| Bonding Methods | Direct-Bonding Epi-Layer-Transfer Oxygen Implantation |
| Other Materials | SOG, GOS |